Services

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[vc_empty_space][td_block_title title_tag=”h4″ big_title_text=”STEDEC” custom_title=”Services”][vc_empty_space]
[td_block_title title_tag=”h4″ custom_title=”Rapid Prototyping Department” block_template_id=”td_block_template_15″ custom_url=”/?page_id=629&lang=en” accent_text_color=”#29b8d1″ f_header_font_size=”20″][td_block_text_with_title custom_title=”1. Polymer (Plastic) 3D Prototyping Service” block_template_id=”td_block_template_9″]

Description of the Service: The service includes low-volume production (prototyping) of the requested parts with two industrial 3D polymer printers within the department.

The production dimensions of the two polymer 3D printers within the department are (x-y-z): 20cm x 25cm x 33cm and 34cm x 34cm x 60cm, respectively.

[/td_block_text_with_title][td_block_text_with_title custom_title=”2. Metal 3D Prototyping Service” block_template_id=”td_block_template_9″]

Description of the Service: The service includes low-volume production (prototyping) of the requested parts with an industrial 3D metal printer within the department.

The production dimensions of the metal 3D printer within the department are (x-y-z): 25cm x 25cm x 30cm, respectively.

[/td_block_text_with_title][td_block_text_with_title custom_title=”3. PCB Prototyping Service” block_template_id=”td_block_template_9″]

Description of the Service: The service includes low-volume PCB (printed circuit) production up to 8 layers (1-2-4-8 layers). Optionally, the boards to be produced can be delivered without surface mount (configured only) or with surface mount (depending on stock availability). 

[/td_block_text_with_title][td_block_text_with_title custom_title=”4. 3D PCB Prototyping Service” block_template_id=”td_block_template_9″]

Description of the Service: The service includes non-planar PCB printing on any curved surface.

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[td_block_title title_tag=”h4″ custom_title=”Measurement, Testing and Instrumentation department” block_template_id=”td_block_template_15″ custom_url=”/?page_id=629&lang=en” accent_text_color=”#29b8d1″ f_header_font_size=”20″][td_block_text_with_title custom_title=”5. Reverse Engineering Service” block_template_id=”td_block_template_9″]

Description of the Service: The service includes scanning provided with a highly sensitive (up to approximately 20 µm) optical scanner within the department. Optionally, the scanned part can be delivered as a point cloud or solid model.

[/td_block_text_with_title][td_block_text_with_title custom_title=”6. Quality Control Service” block_template_id=”td_block_template_9″]

Description of the Service: The service includes detection of production errors by superimposing the scanned part on the solid model of the part, which is scanned with a highly sensitive (up to approximately 20 µm) optical scanner within the department.

[/td_block_text_with_title][td_block_text_with_title custom_title=”7. PCB Testing Service ” block_template_id=”td_block_template_9″]

Description of the Service: The service includes performing all kinds of tests of PCBs and suitable electronic devices within the capacity, with sensitive and very high frequencies (50 GHz) measurement devices within the department.

[/td_block_text_with_title][td_block_text_with_title custom_title=”8. EMC Testing Service ” block_template_id=”td_block_template_9″]

Description of the Service: The service includes electromagnetic compatibility testing, with the 9.4m x 5.5m x 6m anechoic chamber within the department.

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